Home > Technical Ceramic Parts >

DPC technology (Direct Plated Copper)

Product Categories

HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

DPC technology (Direct Plated Copper)

Brand Name : ZG

Model Number : MS

Certification : CE

Place of Origin : China

MOQ : 1 PC

Price : 10USD/PC

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 1000 PCS

Delivery Time : 5-8 work days

Packaging Details : Strong wooden box for Global shipping

Contact Now

DPC technology (Direct Plated Copper)

Stapes of the technological process:

1. Formation of a thin continuous film of conductive material on a ceramic substrate. In this case, there may be holes in the substrate;

2. Applying a photoresist to the formed conductive layer;

3. Exposure and manifestation of photoresist;

4. Galvanic build-up of copper metallization of the required thickness;

5. Application of Ni-Au finish coating;

6. Removing the photoresist from the surface of the board;

7. Chemical etching of the conductive layer remaining on the ceramic after removing the photoresist.

Specifications

Properties	Thick-film technology	DPC
Tolerance	± 10%	± 1%
Adhesion	high	high
Surface roughness Ra, mkm	от 1 до 3	≤ 0,3
Pages

Technology comparance (the 5 - the best items, the 1 - the lowest items)

Properties	DPC	Thin- film technology	Thick-film technology
Electrical conductivity	5	3	4
Thermal conductivity	5	3	4
Stability of parameters	5	5	3
Resolution	4..5 (определяется толщиной медного слоя)	5	2
Cost	5	2	2

Ceramics	Thickness, mkm			Conductive material of the transition holes	Tolerance for the width of the conductor, microns
	Cu	Ni	Au
Al2O3	1... 100	3 ... 5	0,075... 1	Ag, Cu	50
AlN

An equally important characteristic that determines the durability of products is the resistance of the metallized board to temperature effects. Thermal cycling testing was carried out according to MIL-STD-202.107G. This method is designed to determine the stability of a ceramic substrate with metallization to a cyclic temperature change.

Test conditions:

-400C (30 min)~1250 oC (30 min), 500 cycles;
adhesion measurement method: bursting machine;
conditions: adhesion ≥ 3 kg.

Test results

№	Value, кг	Results	№	Value, кг	Results
1	3,84	+	6	3,94	+
2	3,92	+	7	4,11	+
3	4,02	+	8	3,51	+
4	3,76	+	9	3,87	+
5	3,58	+	10	4,01	+
Average adhesion value, кг: 3,86 ± 0,18

Application area

solar collectors;
power electronics:
power integrated circuits;
thermoelectric coolers and generators;
microwave appliances;
Microwave devices;
LED leds.

DPC technology (Direct Plated Copper)

Product Tags: